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AN7024 ED25A CA3130AM PS9634 6025L VT98000Q MBR1070 20A1001
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  281 silicon mos fets (small signal) 2SK0620 (2sk620) silicon n-channel mos fet for switching  features  high-speed switching  mini-type package, allowing downsizing of the sets and automatic insertion through the tape/magazine packing.  absolute maximum ratings (ta = 25c) parameter drain to source breakdown voltage gate to source voltage drain current max drain current allowable power dissipation channel temperature storage temperature symbol v dss v gso i d i dp p d t ch t stg ratings 50 8 100 200 150 150 ? 55 to +150 unit v v ma ma mw c c  electrical characteristics (ta = 25c) parameter drain to source cut-off current gate to source leakage current drain to source breakdown voltage gate threshold voltage drain to source on-resistance forward transfer admittance input capacitance (common source) output capacitance (common source) reverse transfer capacitance (common source) turn-on time turn-off time symbol i dss i gss v dss v th r ds(on) | y fs | c iss c oss c rss t on * t off * conditions v ds = 10v, v gs = 0 v gs = 8v, v ds = 0 i d = 100 a, v gs = 0 i d = 100 a, v ds = v gs i d = 20ma, v gs = 5v i d = 20ma, v ds = 5v, f = 1khz v ds = 5v, v gs = 0, f = 1mhz v dd = 5v, v gs = 0 to 5v, r l = 200 ? v dd = 5v, v gs = 5 to 0v, r l = 200 ? * t on , t off measurement circuit min 50 1.5 20 typ 30 10 20 unit a na v v ? ms pf pf pf ns ns max 10 50 3.5 50 15 5 1 1: gate jedec: to-236 2: source eiaj: sc-59 3: drain mini3-g1 package 0.40 +0.10 0.05 (0.65) 1.50 +0.25 0.05 2.8 +0.2 0.3 2 1 3 (0.95) (0.95) 1.9 0.1 2.90 +0.20 0.05 0.16 +0.10 0.06 0.4 0.2 5 10 0 to 0.1 1.1 +0.2 0.1 1.1 +0.3 0.1 v out v dd = 5v v gs = 5v 50 ? 200 ? 100 f v in 90% 10% 10% 90% v out t on t off marking symbol: 3n internal connection g d s note) the part number in the parenthesis shows conventional part number. unit: mm maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://panasonic.net/sc/en
282 silicon mos fets (small signal) p d  ta i d  v ds | y fs |  v gs c iss , c oss , c rss  v ds i d  v gs r ds(on)  v gs v in  i o 2SK0620 0 160 40 120 80 140 20 100 60 0 240 200 160 120 80 40 ambient temperature ta ( ? c ) allowable power dissipation p d ( mw ) 012 10 8 26 4 0 120 100 80 60 40 20 v gs =6.0v 5.5v 5.0v 4.5v 3.5v 2.5v 3.0v 4.0v ta=25 ? c drain to source voltage v ds ( v ) drain current i d ( ma ) 012 10 8 26 4 0 60 50 40 30 20 10 v ds =5v ta=25 ? c gate to source voltage v gs ( v ) forward transfer admittance |y fs | ( ms ) 1 3 10 30 100 0 12 10 8 6 4 2 v gs =0 f=1mhz ta=25 ? c c iss c oss c rss drain to source voltage v ds ( v ) input capacitance ( common source ) , output capacitance ( common source ) , reverse transfer capacitance ( common source ) c iss ,c oss ,c rss ( pf ) 012 10 8 26 4 0 120 100 80 60 40 20 ta= e 25 ? c 25 ? c 75 ? c v ds =5v ta=25 ? c gate to source voltage v gs ( v ) drain current i d ( ma ) 012 10 8 26 4 0 120 100 80 60 40 20 i d =20ma ta=75 ? c 25 ? c e 25 ? c gate to source voltage v gs ( v ) drain to source on-resistance r ds(on) (  ) 0.1 1 10 100 0.3 3 30 0.01 0.03 0.1 0.3 1 3 10 30 100 v o =5v ta=25 ? c output current i o ( ma ) input voltage v in ( v )
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd.


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